Hey, that's interesting. Never heard of this chip (or Octavo[1]) before! Is anyone from Octavo around? If so, are you guys involved with PocketBeagle? Is it your vehicle to show off the OSD335x? Are you involved with this board at all? What're the plans? It looks like this is still using the AM335x under the covers (in-package). How does that work? You're sourcing the unpackaged silicon from TI and packaging everything up yourselves, or you have a deal with TI where that's happening at their facilities, or...?
Our company does "System-In-Package" which means we integrate bare die, packaged parts and passives on a substrate and then package it up so that it looks like a single BGA from a design / manufacturing standpoint. We source wafers from TI and package everything ourselves. Please feel free to visit the website and look around and let us know if you have any other questions.
I've been doing research on such things for purposes of addressing hardware subversion in supply chain. What kind of equipment and vendor do you use for packaging bare dies? And what's the current cost of such equipment? Thanks ahead of time.
Hey, that's interesting. Never heard of this chip (or Octavo[1]) before! Is anyone from Octavo around? If so, are you guys involved with PocketBeagle? Is it your vehicle to show off the OSD335x? Are you involved with this board at all? What're the plans? It looks like this is still using the AM335x under the covers (in-package). How does that work? You're sourcing the unpackaged silicon from TI and packaging everything up yourselves, or you have a deal with TI where that's happening at their facilities, or...?
Previously: https://news.ycombinator.com/item?id=11662508
1. https://octavosystems.com/about/octavo/