On: Samsung is expected to more than double output of its HBM4 and HBM4E DRAM

[Taniwha]

HBM dies are designed to be physically mounted on top of other dies in the same package, they can have up to 2048 data pins (compared to 8-64 on consumer dies which are in their own packaging) - to do what you propose you'd need an interposer chip of some type which would push the price back up

[m4rtink → Taniwha]

If there is enough scrap chips & enough demand, I can still see it work.