On: TSMC revealing details about next gen A14 node

[FlowingRiver]

I did find it funny recently when Huawei when talking about its folded logic say the Vertical Bonding Pitch's are every 15,000 angstroms. It is a very fancy way of saying an interconnect every 1.5 microns.

[AnotherGoodName → FlowingRiver]

They should just say every 7 silicon atoms at that point.

[fc417fc802 → AnotherGoodName]

7500 surely? But yeah at this point I feel like the diameter of a silicon atom would make for a better unit of measure.

[AnotherGoodName → fc417fc802]

Oh right i was thinking the feature size (about that many namometers not microns)