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I don't know too much about LGAs vs BGAs, but the Wikipedia article mentioned that sockts are "less reliable". How does the reliability compare between BGAs in a socket vs LGAs in a socket? The wikipedia article mentioned that BGAs can move heat around better; is this lost when a socket is used?

I hope Intel doesn't go the socket-less route. This seems like it would alienate the Linux server market for high-reliability servers that depend on CPU hot-plugging. Perhaps this only applies to the consumer market?



BGAs in a socket fail after about 5 years of not being moved, or maybe a dozen times you move things.


Generally, a soldered IC is more physically durable and gets some more heatsinking as a result.




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