I don't think it's really about followimg AMD. It's the only sensible thing to do given the state of scaling and economics.
All interesting things Intel are doing are chiplet based. I think it's partly about showcasing their packaging tech in an attempt to differentiate their fab offering. You could argue there's nothing very special in that respect here, they've done this process and vendor mixing before elsewhere. Except this will be a high volume product line so they need good yield and capacity. But that's just my read on it, maybe it's just the cheapest way to stay relevent.
All interesting things Intel are doing are chiplet based. I think it's partly about showcasing their packaging tech in an attempt to differentiate their fab offering. You could argue there's nothing very special in that respect here, they've done this process and vendor mixing before elsewhere. Except this will be a high volume product line so they need good yield and capacity. But that's just my read on it, maybe it's just the cheapest way to stay relevent.