There is a big difference in making a technology work and making a lot of high yielding wafers with it. I'm not sure Intel 7nm ever got to high volume manufacturing...there were constant delays and yield issues. Read the 3rd article I have below to show how bad it is. Plans to implement SR in 2021, but yields were crap and mass production was put out to 1H23. Intel and TSMC use very different terminology for when things are ready...manufacturing ready (Intel) is being assumed to be the same as high volume manufacturing (TSMC), but they are not the same at all. TSMC is doing 2nm risk production in Q4 this year, we will see what Intel ends up doing...
Example(s): https://www.theverge.com/22597713/intel-7nm-delay-summer-202... https://www.pcmag.com/news/intel-sorry-but-our-7nm-chips-wil... https://www.eenewseurope.com/en/poor-yield-at-intel-delays-s...