I am impressed by the fabrication technology for these heterogenous systems. It was already complex enough to fabricate a CPU, but chiplets require incredible precision for placing the die on the interposer wafer for soldering. And the coplanarity of the whole assembly is critical, else it will be impossible to effectively cool. It's incredible that any of it works.
Agreed...although not sure if it's any more impressive than automated fabs that churn out nanometer precision transistors with billion transistors chips costing less than a cup of coffee per chip.:-)
