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natekupp
on Nov 11, 2011
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Is Moore's Party Over?
Not my area of expertise, but I believe most research today is on microfluidics, introducing microchannels into 3D interconnect layers alongside the TSVs to cool the device. For example,
http://deepaksekar.weebly.com/uploads/1/9/8/6/1986457/3d_mic...
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