Up until now Foveros has only allowed chips to be fully stacked on top of each other. With Foveros Direct, supposely coming in Meteor Lake[1], stacked chips might also having connections from elsewhere (via the base/substrate/interposer/eimb). Previously stacked chips had to have their connectivity & power mediated through another chip, but now stacked chips are supposedly going to be able to have some of their own connectivity as well. This should enable much more interesting stacks.
Intel's process technology might have struggled for a while, but Intel has been developing absolutely top notch ways to combine chips together.
It's less a story about multi-chip, but Intel's really been figuring out how to mix and match in other ways too: the E-cores they ship everywhere are finally an Atom good enough for everyone & that do great. I feel like they've had a lot of really good projects.
Not sure how important this is, but it'll be interesting to see if they can make MCM & this all work for really low power. Intel Galileo showed huge promise as a smart device/application-processor chip, many years back. Lakefield (much bigger, more recent, mobile class) had a lot of promise as an ultraportable chip, but wasn't noticeably enough lower power at it's slower speed, but was so promising & so so small footprint (still better than a Snapdragon!). It's hard to picture the chiplet world being good for edge, good for low power: it feels more like a bigger play. But with all the mix & match strategies, & ability to scale up & down pieces, perhaps they'll develop some really good low power designs too.
Intel's process technology might have struggled for a while, but Intel has been developing absolutely top notch ways to combine chips together.
It's less a story about multi-chip, but Intel's really been figuring out how to mix and match in other ways too: the E-cores they ship everywhere are finally an Atom good enough for everyone & that do great. I feel like they've had a lot of really good projects.
Not sure how important this is, but it'll be interesting to see if they can make MCM & this all work for really low power. Intel Galileo showed huge promise as a smart device/application-processor chip, many years back. Lakefield (much bigger, more recent, mobile class) had a lot of promise as an ultraportable chip, but wasn't noticeably enough lower power at it's slower speed, but was so promising & so so small footprint (still better than a Snapdragon!). It's hard to picture the chiplet world being good for edge, good for low power: it feels more like a bigger play. But with all the mix & match strategies, & ability to scale up & down pieces, perhaps they'll develop some really good low power designs too.
[1] https://fuse.wikichip.org/news/5949/intel-unveils-foveros-om...