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I meant high core count CPUs (intel), not GPUs.



The desktop chips and server chips are not the same chips. You can't bin a different chip as something else. Binning is the practice of taking identical silicon and separating it based on grade and functionality (disabling cores, turning off functionality etc.).

Server CPUs don't even use the same sockets they are fundamentally different.


I was talking about wafers, not dies, but it's all speculation regardless.




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