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| | Interlaken: The ideal high-speed chip-to-chip interface? (design-reuse.com) | |
27 points by peter_d_sherman on April 16, 2023 | past | 9 comments
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| | Microsoft Joins Linaro, Arm and Qualcomm Technologies to Advance Windows on Arm (design-reuse.com) | |
1 point by JoachimS on Feb 10, 2022 | past
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| | PowerVR GPU for RISC-V Available on SiFive Platform (design-reuse.com) | |
4 points by obl on May 15, 2019 | past
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| | Xilinx Announces Adaptive Compute Acceleration Platform (ACAP) (design-reuse.com) | |
3 points by dmichulke on March 19, 2018 | past | 1 comment
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| | Ampere Launches to Accelerate Hyperscale Cloud Computing Innovations (design-reuse.com) | |
2 points by rbanffy on Feb 9, 2018 | past
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| | Enabling Next Generation Vehicles with ARM Artisan Physical IP (design-reuse.com) | |
1 point by rbanffy on April 15, 2017 | past
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| | GAP8: An IoT RISC-V Ultra-Low-power SoC (design-reuse.com) | |
1 point by plix71 on March 13, 2017 | past
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| | Tiempo, Working with STMicroelectronics, Unveils First 32nm Clockless Test Chip (design-reuse.com) | |
1 point by JanusDB on June 1, 2012 | past
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