I think this is their terminology for exposure time. The sensor is integrating charge from incident photons during this period. Of course the image could be stacked also!
Edit: the sensor is integrating CURRENT. Charge is the integral!
Yes, but it also makes thermal shifts faster, thinner packages have less heat capacity, and also crack easier due to more flexibility. The other thing noted in the article is thinner packages mean you have to use thinner metal layers which are what disproportionally do the heat transfer. Silicon transfers ok, but these modern nodes generate so much heat that silicon by itself is not sufficient.
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