> it's not really a bus it's just addressed multiple chips on the same wafer
I'm electronics engineer, and even have once baked one chip layer on semiconductor practice, so I'm aware about technologies.
As I said before on Sinclair, few companies tried to make new on semiconductor market, and even some have success.
RAM manufacturers for a long time using approach of make multi-chip on one wafer - most RAM chips actually have 4..6 RAMs in one package, but few of them don't pass tests and disabled by fuses, so appear chips with 2 or 4 RAMs enabled and even with odd number of enabled chips.
Looks like Cerebras use similar to RAM manufacturers approach, just for other niche.
I'm electronics engineer, and even have once baked one chip layer on semiconductor practice, so I'm aware about technologies.
As I said before on Sinclair, few companies tried to make new on semiconductor market, and even some have success.
RAM manufacturers for a long time using approach of make multi-chip on one wafer - most RAM chips actually have 4..6 RAMs in one package, but few of them don't pass tests and disabled by fuses, so appear chips with 2 or 4 RAMs enabled and even with odd number of enabled chips.
Looks like Cerebras use similar to RAM manufacturers approach, just for other niche.