As a comparison to FOSS this is the equivalent of releasing a binary and some header files.
That was said about the devkit.
Gerber files are supposed to be released in a few years, after recouping development costs.
Also from the overall style it looks to me like the schematics actually were created by some east asian ODM and not by Puri.sm themselves.
"We cannot share the schematics nor design currently because it is copyright encumbered from Intel reference designs. In the future, on future versions we plan to be able to release those."
How safe are those now that the Intel vulnerabilities are known? I doubt hardware that old is getting microcode updates.
I find this more troubling than the idea of early batches shipping with pre-beta quality software. At least improvements to software can be pushed out to older devices. If you buy an early batch and get a phone the size and weight of a brick, though, that phone is always going to be the size and weight of a brick.
I assume that the specs will change batch to batch.
iPhone XS: 7.5mm x 143.6 x 70.9
iPhone XS max: 7.7mm x 157.5 x 77.4
> My garbage kitchen scale says 231 g.
At page 15 and 16 there are some M.2 connectors. One has an USB line named USB2_WIFI_D* and the other USB2_4G_D* so I guess these are used for 2 external radio modules (WIFI/BT and 4G).
I wonder what these modules are. Will it ship with the same from the devkit (RedPine WiFi/BT M.2 module on SDIO, SIMCom SIM7100E)? Pretty important from a security/privacy standpoint.
If you don't want a pre-production product, don't opt in for it and wait for Evergreen.
Currently I doubt there's enough demand for the Librem phone to justify cloning though.